METHOD FOR MANUFACTURING A THIN SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a thin semiconductor package is provided to densely form a space between leads by applying photolithography technology. CONSTITUTION: A first mask pattern is formed on a silicon substrate. A land type lead (120) is formed by using the first mask pattern. The first mask pattern is removed. A semiconductor chip (126) is mounted on the chip pad region of the silicon substrate. An encapsulant (130) for encapsulating the land type lead and the semiconductor chip is formed.