SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for fabricating the same are provided to improve electrical characteristics by electrically connecting an upper and a lower package by using high conductivity metal balls. CONSTITUTION: A semiconductor chip (220) is mounted on the first surface of a substrate. At least one electrode pad is arranged on the first surface of the substrate. A conductive ball (210) is arranged on the electrode pad. A molding part (230) molds the upper part of the first surface of the substrate. A bonding member is arranged on the second surface of the substrate.