| 摘要 |
PURPOSE: A solder-mounted board, a production method therefor, and a semiconductor device are provided to prevent the filling failure of an under fill by arranging a line layer in the inner region of a mounting component. CONSTITUTION: A line is formed in at least one direction of a substrate. A solder pad (2) mounts a component by a soldering process. An insulating layer exposes the solder pad. The insulating layer surrounds the line. A second insulation layer (5) is installed on at least one part of a first insulation layer (4). |
