METHOD FOR MANUFACTURING THERMOELECTRIC MODULE AND THERMOELECTRIC MODULE THEREBY

摘要

PURPOSE: A thermoelectric module manufacturing method finely adjusts the thickness of an electrode, a P-type semiconductor, and an N-type semiconductor in a thermoelectric module to be slim by forming the electrode, the P-type semiconductor, and the N-type semiconductor on a substrate by screen printing. CONSTITUTION: A bottom electrode is formed on the upper side of a bottom substrate (S100). A P-type semiconductor and an N-type semiconductor are printed on the upper side of the bottom electrode (S220). An insulating material is filled in the sides of the bottom electrode, the P-type semiconductor, and the N-type semiconductor (S300). A top electrode is formed on the upper sides of the P-type semiconductor and the N-type semiconductor (S400). A top substrate adheres to the upper side of the top electrode (S500). [Reference numerals] (AA) Start; (BB) End; (S100) Bottom electrode is formed on the upper side of a bottom substrate; (S200) P-type semiconductor and an N-type semiconductor are printed on the upper side of the bottom electrode; (S300) Insulating material is filled in the sides of the bottom electrode, the P-type semiconductor, and the N-type semiconductor; (S310) Ultraviolet rays are irradiated to harden the insulating material; (S400) Top electrode is formed on the upper sides of the P-type semiconductor and the N-type semiconductor; (S510) Adhesive is sprayed on the upper side of the top electrode; (S520) Top substrate is placed and bonded on the upper side of the adhesive