发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING PATTERN USING THE COMPOSITION
摘要 <p>PURPOSE: A photosensitive resin composition and a manufacturing method of patterns using the same are provided to have high sensitivity even when the photosensitive resin composition uses g,h line scanner or low NA exposure device (NA=0.1 or less) and to enhance resolution same as l line stepper and sphericity. CONSTITUTION: A photosensitive resin composition comprises a polymer having configuration units represented by chemical formula (a-1) and configuration units having acids; a polymer having configuration units represented by chemical formula (a-2); photo acid generator; and solvent. In the chemical formulas, R^1 and R^2 respectively represent hydrogen atom, alkyl group or aryl group. One of the R^1 and R^2 represents alkyl group or aryl group. R^3 represents alkyl group or aryl group. R^1 or R^2 and R^3 are connected to form cyclic ether. R^4 represents hydrogen atom or methyl group. X represents a single bond or arylene group.</p>
申请公布号 KR20130111355(A) 申请公布日期 2013.10.10
申请号 KR20130031907 申请日期 2013.03.26
申请人 FUJIFILM CORPORATION 发明人 NAKAMURA HIDEYUKI;FUJIMOTO SHINJI;YAMASHITA SHIE
分类号 G03F7/004;G02F1/13;G03F7/028;G03F7/26 主分类号 G03F7/004
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