Cooling device for power semiconductor component, has resonance pipe arranged between sonotrode element and cooling body, where distance between element and body corresponds to integral multiples of quarter of predetermined wavelength

摘要

The device (26) has a thermal cooling body (14) connected with an electronic component. A sonotrode element (12) generates ultrasonic waves of predetermined wavelength, where the ultrasonic waves are directed towards the cooling body. A resonance pipe (16) is associated with the sonotrode element and arranged between the sonotrode element and the cooling body. Distance between the sonotrode element and the cooling body corresponds to integral multiples of quarter of the predetermined wavelength.