发明名称 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND ELECTRONIC APPARATUS
摘要 <p>This solid-state image pickup apparatus is provided with: a semiconductor layer (17); a photoelectric conversion section or a charge holding section, which is disposed on the light receiving surface side of the semiconductor layer (17); a connecting section (21), which is formed on the semiconductor layer (17), and reads out signal charges generated by means of the photoelectric conversion section or the charge holding section; a charge accumulating section (23) having the signal charges accumulated therein, said signal charges having been read out by means of the connecting section (21); a potential barrier section (22), which is provided between the connecting section (21) and the charge accumulating section (23); and an element isolating section (27), which is configured of a trench (54) surrounding the side surfaces of the connecting section (21), and an insulating layer (25) formed in the trench (54).</p>
申请公布号 WO2013150839(A1) 申请公布日期 2013.10.10
申请号 WO2013JP55113 申请日期 2013.02.27
申请人 SONY CORPORATION 发明人 KOGA FUMIHIKO;TAKEO AKIRA
分类号 H01L27/146;H04N5/374 主分类号 H01L27/146
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