| 摘要 |
<p>In a chip element having a substrate, an impedance element formed on the substrate, and a plurality of electrodes formed on the substrate to be connected to the impedance element, the substrate is formed of a low-permittivity material having a permittivity low enough to decrease the parasitic capacitance in a GHz range. The substrate further includes at least a synthetic resin and an inorganic compound.</p> |
