发明名称 Patterning method and method for manufacturing semiconductor device
摘要 In one embodiment, a patterning method is disclosed. The method includes applying an uncured imprint material containing a first curing agent and a second curing agent onto a substrate. The method includes pressing a template against the imprint material. The method includes reacting the first curing agent with the template pressed against the imprint material. The method includes stripping the template from the imprint material. In addition, the method includes reacting the second curing agent.
申请公布号 US8551393(B2) 申请公布日期 2013.10.08
申请号 US20100836684 申请日期 2010.07.15
申请人 KOBAYASHI YOSHIHITO;KABUSHIKI KAISHA TOSHIBA 发明人 KOBAYASHI YOSHIHITO
分类号 B29C35/08 主分类号 B29C35/08
代理机构 代理人
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