CONDUCTIVE PASTE FOR DIE-BONDING, AND DIE-BONDING METHOD USING THE CONDUCTIVE PASTE

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste for die-bonding a semiconductor element and the like to a substrate, capable of suppressing generation of defects such as a void generated at a bonded part.SOLUTION: A conductive paste for die-bonding consists of a metal powder and an organic solvent. The metal powder consists of: one or more kinds of metal particles chosen from silver powder, palladium powder, and copper powder that have purity of 99.9 mass% or more and an average particle diameter of 0.01-1.0 μm; and a coating layer covering at least a part of the metal particles and consisting of gold.