| 摘要 |
An LED light module and an LED chip are provided. LED wafers (1) are provided on one side of a heat spreading plate (3) made of copper, aluminum or copper-aluminum composite material with a thickness of more than 0.4 mm and with an area of 5 times of the sum area of the LED wafers larger to reduce the heat-flux density. A high-voltage insulation plate (2) made of a ceramic wafer with a thickness of more than 0.15 mm is provided on the other side of the heat spreading plate (3). The heat spreading plate (3) is separated and insulated by an outer layer insulator (4) with the high-voltage insulation plate (2). This kind design can effectively reduce the internal conduction thermal resistance and raise the insulation strength, and the manufacturing cost can be reduced effectively also.
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