| 摘要 |
Use of a hot-melt adhesive for adhesive bonding of at least a first packaging and a second packaging, the hot-melt adhesive comprising: (a) 50-85 parts per weight of a basis polymer, wherein the basis polymer is consisting of a metallocene catalysed poiyolefln polymer, preferably ethene-1-octene-copolymer; (b) 1 0-25 parts per weight of a modifying polymer, the modifying polymer comprising a styrene block copolymer; (c) 5-25 parts per weight of a reinforcing wax, preferably a polyethylene wax or a wax produced by the Fischer-Tropsch synthesis route, the wax component preferably comprising paraffinic oil, naphthenic oil, polybutene, dibasic ester, polyol or mixtures thereof; and (d) 0.05-1.5 parts per weight of a stabilizer component comprising a sterically hindered phenolic antioxidant and/or a hindered amine light stabilizer and a pack comprising the hot-melt adhesive. |
