PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABRICATION METHOD THEREOF

摘要

A package structure having an embedded electronic element includes: a substrate having two opposite surfaces and a cavity penetrating the two opposite surfaces; at least a metal layer disposed on the sidewall of the cavity and extending to the surfaces of the substrate; an electronic element disposed in the cavity and having a plurality of electrode pads disposed on side surfaces thereof; and a solder material electrically connecting the electrode pads of the electronic element and the metal layer, thereby effectively alleviating the problems of alignment difficulty and high fabrication cost as encountered in the prior art.