发明名称 |
JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF |
摘要 |
A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
|
申请公布号 |
US2013258632(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201313804376 |
申请日期 |
2013.03.14 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
EBE HIROFUMI;FURUKAWA YOSHIHIRO |
分类号 |
B23K35/24;H05K1/11;H05K13/04 |
主分类号 |
B23K35/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|