| 摘要 |
PURPOSE: A conductive die adhesive composition is provided to have excellent high temperature workability and low moisture absorption, to improve thermal conductivity and impact absorption, and to have excellent storage stability. CONSTITUTION: A conductive die adhesive composition comprises one or more kinds of acrylic monomers, butadiene compounds, a thermosetting agent, a silane coupling agent, and silver or silver-coated copper powder as a conductive metal component. The acrylic monomer is one or more selected from di- or polyacrylate of aromatic diol or polyol, di- or polyacrylate of aliphatic diol or polyol, and tri- or polyacrylate. The butadiene compound is one or more selected from carboxyl-terminated butadiene nitrile rubber and epoxy-substituted butadiene. |
