发明名称 METHOD OF PROTECTING COMPONENT OF FILM FORMING APPARATUS AND FILM FORMING METHOD
摘要 PURPOSE: A method for protecting the component of a film forming apparatus and a film forming method are provided to relieve a tensile stress by using a silicon layer as a coating layer for protecting a component. CONSTITUTION: A rough surface layer (2) is formed on the surface of a component (1) before or after a film forming process is performed on an object substrate in the process room of a film forming apparatus. The component is formed in the process chamber of the film forming apparatus. The component is exposed under a film forming atmosphere in the film forming process.
申请公布号 KR20130108182(A) 申请公布日期 2013.10.02
申请号 KR20130030849 申请日期 2013.03.22
申请人 TOKYO ELECTRON LIMITED 发明人 TONEGAWA YAMATO;SATO HIDENOBU;SASAKI KOJI;TAKAHASHI NOBUHIRO;SUZUKI KEISUKE
分类号 H01L21/205;C23C16/44;H01L21/31 主分类号 H01L21/205
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