发明名称 |
METHOD OF PROTECTING COMPONENT OF FILM FORMING APPARATUS AND FILM FORMING METHOD |
摘要 |
PURPOSE: A method for protecting the component of a film forming apparatus and a film forming method are provided to relieve a tensile stress by using a silicon layer as a coating layer for protecting a component. CONSTITUTION: A rough surface layer (2) is formed on the surface of a component (1) before or after a film forming process is performed on an object substrate in the process room of a film forming apparatus. The component is formed in the process chamber of the film forming apparatus. The component is exposed under a film forming atmosphere in the film forming process. |
申请公布号 |
KR20130108182(A) |
申请公布日期 |
2013.10.02 |
申请号 |
KR20130030849 |
申请日期 |
2013.03.22 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TONEGAWA YAMATO;SATO HIDENOBU;SASAKI KOJI;TAKAHASHI NOBUHIRO;SUZUKI KEISUKE |
分类号 |
H01L21/205;C23C16/44;H01L21/31 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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