发明名称 Wafer transfer pod for reducing wafer particulate contamination
摘要 A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween. The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.
申请公布号 US8544651(B2) 申请公布日期 2013.10.01
申请号 US201213354969 申请日期 2012.01.20
申请人 ZHANG YING;CHENG TIEN-CHIH;SUEN SHU-HUEI;LIU YU-CHENG;CHIOU JIAN-HUAH;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 ZHANG YING;CHENG TIEN-CHIH;SUEN SHU-HUEI;LIU YU-CHENG;CHIOU JIAN-HUAH
分类号 B65D81/02;B65D81/18 主分类号 B65D81/02
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