发明名称 |
Wafer transfer pod for reducing wafer particulate contamination |
摘要 |
A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween. The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.
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申请公布号 |
US8544651(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US201213354969 |
申请日期 |
2012.01.20 |
申请人 |
ZHANG YING;CHENG TIEN-CHIH;SUEN SHU-HUEI;LIU YU-CHENG;CHIOU JIAN-HUAH;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
ZHANG YING;CHENG TIEN-CHIH;SUEN SHU-HUEI;LIU YU-CHENG;CHIOU JIAN-HUAH |
分类号 |
B65D81/02;B65D81/18 |
主分类号 |
B65D81/02 |
代理机构 |
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代理人 |
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