发明名称 |
Planar interconnect structure for hybrid circuits |
摘要 |
Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
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申请公布号 |
US8546186(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US201213435548 |
申请日期 |
2012.03.30 |
申请人 |
DUMAS CRAIG;SUNDERMURTHY VIJAYKUMAR;STARKEY LABORATORIES, INC. |
发明人 |
DUMAS CRAIG;SUNDERMURTHY VIJAYKUMAR |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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