| 摘要 |
PROBLEM TO BE SOLVED: To suppress progress of peeling of a die pad and a sealing resin toward an edge of the die pad.SOLUTION: A sealing resin 300 seals a semiconductor chip 100, bonding wires 400 and 410, and an inner lead of a lead 220. A rear surface of a die pad 210 is exposed from the sealing resin 300. The rear surface of the die pad 210 is provided with a first groove 212. The sealing resin 300 is not inserted into the first groove 212 or the groove 212 is not fully filled with the sealing resin 300 even if the sealing resin is inserted into the first groove. In a planar view, the first groove 212 is positioned closer to a center side of the die pad 210 than the junction between the bonding wire 410 and the die pad 210. |
