发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which has a two-layer SOI structure.SOLUTION: In a semiconductor device, 1st semiconductor layers (5 and 6) a part of which is regulated by a first embedded insulating film 7 are provided on a semiconductor substrate 1 through 1st interlayer insulating films (2-4). A gate electrode 13 is provided which encloses a periphery of a part 6 of the semiconductor layer through a gate insulating film 12. A MISFET which has a structure in which source drain regions (8-11) are provided by self-matching with a gate electrode 13 is formed on the 1st semiconductor layer. Further, 2nd semiconductor layers (19 and 20) a part of which is regulated by a second embedded insulating film 21 are provided through second interlayer insulating films (15-18) that are stacked. A gate electrode 27 is provided which encloses a periphery of a part 20 of the semiconductor layer through a gate insulating film 26. The MISFET having a structure in which source drain regions (22-25) are provided by self-matching with the gate electrode 27 is formed on a second semiconductor layer.
申请公布号 JP2013197171(A) 申请公布日期 2013.09.30
申请号 JP20120060396 申请日期 2012.03.16
申请人 SHIRATO TAKEHIDE 发明人 SHIRATO TAKEHIDE
分类号 H01L29/786;H01L21/02;H01L21/28;H01L21/3205;H01L21/336;H01L21/76;H01L21/762;H01L21/768;H01L21/8234;H01L23/522;H01L23/532;H01L27/08;H01L27/088;H01L27/12;H01L29/423;H01L29/49 主分类号 H01L29/786
代理机构 代理人
主权项
地址
您可能感兴趣的专利