发明名称 |
LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: A light emitting diode package is provided to emit light in a lateral direction by forming a package body with transparent materials to mount a chip. CONSTITUTION: A package body (130) has an opened well structure. The package body has a partition structure along edges. A fluorescent substance (140) is formed on the opened well structure. The package body is made of transparent materials. The upper surface of the package body and the upper surface of the fluorescent substance are formed on the same plane. |
申请公布号 |
KR20130106149(A) |
申请公布日期 |
2013.09.27 |
申请号 |
KR20120027821 |
申请日期 |
2012.03.19 |
申请人 |
LG DISPLAY CO., LTD. |
发明人 |
JUNG, NACK YOUN;HAN, MYUNG SOO |
分类号 |
H01L33/50;H01L33/48 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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