| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent all in Tg, low thermal expansion, copper foil adhesivity, heat resistance, moisture resistance, flame retardancy, heat resistance with copper, low dielectric property and low dielectric loss tangent, and use of the same, and a prepreg, a laminated plate and the like using the same.SOLUTION: A thermosetting resin composition contains, as essential components, (1) a compatibilization resin obtained by reacting a siloxane resin (a) having hydroxyl groups on terminals thereof, a compound (b) having at least two isocyanate groups in one molecule thereof, and a compound (c) having at least two epoxy groups in one molecule thereof, using an organometal salt (d) as a reaction catalyst, (2) a fused silica surface-treated (wet treatment) with an N-phenyl-3-aminopropyltrimethoxysilane compound, and (3) a compound containing an imidazole structure in the molecular structure. |
