发明名称 METHOD FOR SEALING ELECTRIC AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a sealing method applicable to electric and electronic components having a complicated shape.SOLUTION: The method for sealing electric and electronic components includes a step for arranging a sheet for sealing material in which values of a storage elastic modulus (E') at 120°C and a loss tangent (tan &delta;) satisfy all of the following conditions 1 to 5, and the electric and electronic components in a vacuum heating device with the sheet in contact with the electric and electronic components, and holding them for 30 or more seconds by setting the pressure inside the vacuum heating device to <500 Pa and a temperature to &ge;80°C and a step for setting the pressure inside the vacuum heating device &ge;30 KPa after the step. A condition 1: when an angular frequency &omega;=100 rad/seconds, E' is 1.0×10to 10×10, and tan &delta; is 0.5-10, a condition 2: when an angular frequency &omega;=100 rad/seconds, E' is 100 to 1.0×10, and tan &delta; is 3-50, a condition 3: when an angular frequency &omega;=1 rad/second, E' is 10 to 100, and tan &delta; is 10 to 100, a condition 4: when an angular frequency &omega;=0.1 rad/second, E'is 0.1 to 1.00, and tan &delta; is 100 to 1000, and a condition 5: when an angular frequency &omega;=0.01 rad/seconds, E'is 0.01 to 0.1, and tan &delta; is 100 to 1000.
申请公布号 JP2013191592(A) 申请公布日期 2013.09.26
申请号 JP20120054475 申请日期 2012.03.12
申请人 IDEMITSU UNITECH CO LTD 发明人 NAKATANI JUNJI
分类号 H01L21/56;H01L23/29;H01L23/31;H01L31/042 主分类号 H01L21/56
代理机构 代理人
主权项
地址