| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
<p>The present invention has a tray (10) corresponding to a heat sink, a circuit part (60) is accommodated in an accommodating part (15) of the tray, and the circuit part is potting-sealed with a sealing resin (70) such that external electrodes (41, 43) are exposed. The sealing resin covers and seals a top part (10a) of the tray.</p> |
| 申请公布号 |
WO2013141287(A1) |
申请公布日期 |
2013.09.26 |
| 申请号 |
WO2013JP58028 |
申请日期 |
2013.03.21 |
| 申请人 |
MITSUBISHI ELECTRIC CORPORATION;FUJINO, JUNJI;KASHIBA, YOSHIHIRO;OGAWA, SHOHEI |
发明人 |
FUJINO, JUNJI;KASHIBA, YOSHIHIRO;OGAWA, SHOHEI |
| 分类号 |
H01L23/28;H01L21/56;H01L23/34;H01L23/48 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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