发明名称 |
INTEGRATED CAPACITORS IN PACKAGE-LEVEL STRUCTURES, PROCESSES OF MAKING SAME, AND SYSTEMS CONTAINING SAME |
摘要 |
An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure. |
申请公布号 |
KR101312135(B1) |
申请公布日期 |
2013.09.26 |
申请号 |
KR20117021787 |
申请日期 |
2006.12.11 |
申请人 |
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发明人 |
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分类号 |
H01L23/498;H01L23/52;H01L23/64 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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