摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cooling apparatus and a substrate cooling method which effectively and accurately cool a substrate without causing damage to the substrate while reducing the manufacturing costs of the apparatus.SOLUTION: A substrate cooling apparatus includes: a cooling chamber 1 having a carry-in port 11 and a carry-out port 12; and a transfer mechanism composed of multiple transfer rollers 2 supporting a lower surface of the substrate 100 and transferring the substrate 100 from the carry-in port 11 to the carry-out port 12 of the cooling chamber 1 in a horizontal direction. Further, the substrate cooling apparatus includes: a cooling air knife 3; a coolant accumulation container 4 supplying a coolant to the lower surface of the substrate 100 transferred by the transfer rollers 2 and forming a liquid film of the coolant on the lower surface of the substrate 100; a current plate 7; a doctor blade 8; a coolant removal air knife 6; and a scattering prevention air knife 5. |