发明名称 |
METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, AND SOLAR CELL MODULE |
摘要 |
A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes. |
申请公布号 |
US2013247977(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
US201313896853 |
申请日期 |
2013.05.17 |
申请人 |
TOPPAN PRINTING CO., LTD. |
发明人 |
KUMAI KOICHI;UEDA RYUJI;KUBOTA KENTARO;KUDO SHIGEKI;KAWASAKI MINORU |
分类号 |
H01L31/02;H05K1/02;H05K3/20 |
主分类号 |
H01L31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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