发明名称 ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
摘要 There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t1 and t2 of the first and second internal electrodes is 0.9 mum or less, while a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode.
申请公布号 US2013250476(A1) 申请公布日期 2013.09.26
申请号 US201313737504 申请日期 2013.01.09
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHUNG HAE SOCK;LEE BYOUNG HWA;CHAE EUN HYUK;PARK MIN CHEOL
分类号 H01G4/01 主分类号 H01G4/01
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