发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with a structure that allows manufacturing a semiconductor photo-relay by a simple process, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device includes: a semiconductor substrate; a light-emitting element provided on the semiconductor substrate; a light-receiving element being spaced apart from the light-emitting element and provided on the same surface of the semiconductor substrate as the surface on which the light-emitting element is formed; and a switching element provided on the same surface of the semiconductor substrate as the surface on which the light-emitting element is provided, so as to be electrically isolated from the light-emitting element. A method of manufacturing the semiconductor device includes the steps of: forming the light-emitting element and the switching element on the same surface of the semiconductor substrate and forming the light-receiving element so as to be electrically isolated from the light-emitting element; and etching the light-emitting element and the switching element so as to be spaced apart from each other.
申请公布号 JP2013191705(A) 申请公布日期 2013.09.26
申请号 JP20120056515 申请日期 2012.03.13
申请人 TOSHIBA CORP 发明人 MIYAGAKI ATSUSHI
分类号 H01L31/12 主分类号 H01L31/12
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