| 摘要 |
Lead frame (10) having both electrically conductive (12) and electrically non-conductive (41) tie-bar portions. The electrically conductive tie-bar portion (12) allows the attached leads (11) to be simultaneously electroplated, yet is removable from the lead frame, leaving the electrically non-conductive tie-bar portion (41) which provides support for the leads. The advantages to the electrically non-conductive tie-bar portion (41) include substantially decreasing the leads' bending and/or breaking from the package, during both manufacturing and/or testing of the integrated circuit. |
