发明名称 Bonding Method Between Pad for Touch Panel and Circuit Board and Assembly Prepared Thereby
摘要 PURPOSE: A combination method between a pad for a touch panel and a board is provided to prevent the generation of bubble in a connection between a window and a TSP(Touch Screen Panel). CONSTITUTION: A pad for a touch panel includes a touch pattern and a lead wire and forms an insulation layer with a connection electrode including a metal coating layer by extending one end of the lead wire to an edge. A board combines the connection electrode and a combination electrode. The connection electrode faces to the combination electrode. The pad for the touch panel includes the insulation layer, a transparent conductive coating layer accumulated on the insulation layer, the metal coating layer, an adhesion layer, and the combination layer. [Reference numerals] (11,15,50,60) PET(125um); (12,15,50,60) Indium-tin oxide; (13,15,50,60) Metal; (14) OCA(100um); (15) Liner(75um); (50) Top; (60) Build-operate-transfer; (90) Jig application; (AA) Top inter-layer structure; (BB,CC) A lower layer is eliminated
申请公布号 KR101311407(B1) 申请公布日期 2013.09.25
申请号 KR20110018726 申请日期 2011.03.03
申请人 发明人
分类号 G06F3/041 主分类号 G06F3/041
代理机构 代理人
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