发明名称 |
Electronic component |
摘要 |
Component has a housing body (1), which has a recess (2) arranged with opto-electronic component (6) in it. A polyimide has foil (3), which is so arranged on the recess that a cavity is formed. The foil is fixed by an adhesive layer (4) on the housing body. The foil has one layer (31), comprises the polyimide, and another layer. An independent claim is also included for: a method for the encapsulation of an electronic component. |
申请公布号 |
EP1826832(A3) |
申请公布日期 |
2013.09.25 |
申请号 |
EP20070003234 |
申请日期 |
2007.02.15 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
BEHRINGER, MARTIN;FELTGES, HARALD;HOEFER, THOMAS;MOELLMER, FRANK |
分类号 |
H01L33/00;H01L31/0203;H01L33/58 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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