LED PACKAGE USING SILICON SHEET AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An LED package using a silicon sheet and a manufacturing method thereof are provided to improve the adhesion between elements. CONSTITUTION: A silicon lamination sheet (10) has at least one hole (11). An LED chip (30) is placed in the hole. An electric conduction plate (20) is combined with the silicon lamination sheet. The electric conduction plate includes a chip mounting part. The chip mounting part corresponds to the hole.