| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of efficiently forming a pattern.SOLUTION: A method of manufacturing a semiconductor device includes the steps of: forming a sacrifice portion on a substrate on which a semiconductor element is formed; shortening the width dimension of the sacrifice portion; forming a film that covers the sacrifice portion; exposing a top surface of the sacrifice portion by removing the formed film and forming a frame body that surrounds the sacrifice portion; removing the sacrifice portion; and forming a first element and a second element by removing a part of the frame body. In the step of forming the film that covers the sacrifice portion, the film is formed using a material with conductivity. In the step of forming the first element and the second element, the first element is formed in a first direction when viewed from the center of the frame body, and the second element is formed in a second direction crossing the first direction when viewed from the center of the frame body. The first element functions as an electrode of the semiconductor element. |
