发明名称 CONTACT STRUCTURE OF VIBRATION SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a contact structure of a vibration sensor, which achieves the prevention of increase in bulk.SOLUTION: A non-through hole 2 which penetrates through a base plate 1 in a thickness direction of the base plate 1 is provided at a required position on the base plate 1. A pair of contacts 3, 4 which seal the non-through hole 2 from both front and back sides of the base plate 1 are mounted on the base plate 1. A contact ball 5 which can move, relative to the pair of the contacts 3, 4, between a contact position where both of the contacts 3, 4 are electrically connected and an alienation position where both of the contacts 3, 4 are not electrically-connected is arranged in the non-through hole 2.
申请公布号 JP2013185919(A) 申请公布日期 2013.09.19
申请号 JP20120050534 申请日期 2012.03.07
申请人 TOKAI RIKA CO LTD 发明人 NISHIMOTO KEIGO
分类号 G01H1/00 主分类号 G01H1/00
代理机构 代理人
主权项
地址