| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing tape-integrated adhesive film, capable of easily performing, when electrically connecting a first terminal of a first substrate to a second terminal of a second substrate, positioning thereof, and a semiconductor device using such a dicing tape-integrated adhesive film.SOLUTION: A dicing tape-integrated adhesive film includes an adhesive film for adhering a first substrate to a second substrate; and a dicing tape laminated thereon, and is configured to satisfy the following expressions (1) and (2) when the adhesive film is provided in an average thickness t [μm], and the absorption coefficient in a light of wavelength 800 nm of the adhesive film is α [1/μm]. α×t≤-log(0.05)...(1). 1≤t≤200...(2). |
