| 摘要 |
Disclosed is a process for producing a circuit wiring board comprising a step (S1) of coating a coating liquid containing a polyimide precursor resin and a metal compound onto a base material to form a coating film, a step (S2) of forming a resist mask pattern on a surface of the coating film, a step (S3) of reducing metal ions in the coating film to form a metal deposit layer, a step (S4) of forming a circuit wiring having a pattern by plating on the metal deposit layer, and a step (S5) of heat treating the polyimide precursor resin layer to imidate the polyimide precursor resin and thus to form a polyimide resin layer.
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