发明名称 |
Integrated circuit package and method of assembling an integrated circuit package |
摘要 |
A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.
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申请公布号 |
US8536717(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US201213347327 |
申请日期 |
2012.01.10 |
申请人 |
LOW SHIN S.;SINGH INDERJIT;XILINX, INC. |
发明人 |
LOW SHIN S.;SINGH INDERJIT |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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