发明名称 |
METHOD FOR MANUFACTURING LED PACKAGE STRUTURE AND METHOD FOR MANUFACTURING LEDS USING THE LED PACKANGE STRUTURE |
摘要 |
A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.
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申请公布号 |
US2013236996(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201213714418 |
申请日期 |
2012.12.14 |
申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHEN PIN-CHUAN;LIN HSIN-CHIANG;CHEN LUNG-HSIN |
分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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