SHEET FOR FORMING RESIN FILM FOR CHIPS

摘要

[Problem] To impart heat release properties to a resulting semiconductor device without increasing the number of semiconductor device production steps or subjecting the semiconductor wafer or chip to special treatment that will complicate the process. [Solution] The sheet for forming a resin film for chips comprises a support sheet and a resin film-forming layer formed on the support sheet, wherein the resin film-forming layer comprises binder polymer component (A), curable component (B) and inorganic filler (C), and the thermal diffusivity of the resin film-forming layer is 2 x 10-6 m2/s or greater.