发明名称
摘要 The present invention relates to a light emitting diode (LED) module (10), comprising at least one LED chip (12) having a surface (13) for emitting light, and a ceramic conversion plate (14). The LED module is characterized in that the ceramic conversion plate includes a first segment (18) covering a first portion of the light emitting surface of the LED chip(s) and a second segment (20) provided alongside the first segment covering a second portion of the light emitting surface of the LED chip(s), wherein at least one of the segments comprises a wavelength-converting material for converting light emitted from the LED chip(s) to a certain wavelength. The present invention also relates to a method for the manufacturing of such an LED module, and a ceramic conversion plate for use in an LED module.
申请公布号 JP5285435(B2) 申请公布日期 2013.09.11
申请号 JP20080557860 申请日期 2007.02.22
申请人 发明人
分类号 H01L33/50 主分类号 H01L33/50
代理机构 代理人
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