| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity, a low dielectric constant and an excellent exposure margin.SOLUTION: The photosensitive resin composition comprises: (A) a polymer component satisfying at least one of the following conditions (1) and (2); (B) two or more kinds of photoacid generators; and (D) a solvent. The polymer component includes: (1) a polymer having a structural unit (a1) including a residue in which an acid group is protected by an acid decomposable group and a structural unit (a2) having a crosslinking group; or (2) a polymer (a1) having a structural unit including a residue in which an acid group is protected by an acid decomposable group, and a polymer (a2) having a structural unit having a crosslinking group. In (B) the two or more kinds of photoacid generators, at least one is a compound (B-F) that responds to light to generate an acid including fluorine in the molecule, and at least one of the other is a compound excluding (B-F). The (B-F) compound is selected from a triarylsulfonium salt, diaryliodonium salt, oxime sulfonate compound, imide sulfonate compound and diazomethane compound. |
