发明名称 |
TOUCHPAD STRUCTURE AND MANUFACTURING METHOD THEREOF |
摘要 |
A touchpad structure includes a substrate, a shielding layer and a sensing layer. The shielding layer fully covers a first surface of the substrate. By using a circuit forming process to form the sensing layer on the shielding layer so as to make the shielding layer sandwiched between the substrate and the sensing layer, the structural thickness and the manufacturing processes of the overall touchpad structure can be significantly reduced.
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申请公布号 |
US2013229365(A1) |
申请公布日期 |
2013.09.05 |
申请号 |
US201213567255 |
申请日期 |
2012.08.06 |
申请人 |
LIN YU-KAI;TSAI CHIEN-WEN;HO MING-LUNG |
发明人 |
LIN YU-KAI;TSAI CHIEN-WEN;HO MING-LUNG |
分类号 |
G06F3/041;H01H11/00 |
主分类号 |
G06F3/041 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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