发明名称 EMBEDDED DRAM MEMORY CELL WITH ADDITIONAL PATTERNING LAYER FOR IMPROVED STRAP FORMATION
摘要 A method of forming a memory cell including forming trenches in a layered semiconductor structure, each trench having an inner sidewall adjacent a section of the layered semiconductor structure between the trenches and an outer sidewall opposite the inner sidewall. The trenches are filled with polysilicon and the patterning layer is formed over the layered semiconductor structure. An opening is then patterned through the patterning layer, the opening exposing the section of the layered semiconductor structure between the trenches and only a vertical portion of the polysilicon along the inner sidewall of each trench. The layered semiconductor structure is then etched. The patterning layer prevents a second vertical portion of the polysilicon along the outer sidewall of each trench from being removed.
申请公布号 US2013228840(A1) 申请公布日期 2013.09.05
申请号 US201313865306 申请日期 2013.04.18
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;DOBUZINSKY DAVID M.;KIM BYEONG Y.;NAEEM MUNIR D.
分类号 H01L27/12 主分类号 H01L27/12
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