摘要 |
A reference buffer amplifier within an integrated circuit includes a first output terminal connected to a first bond pad, the first bond pad being connected to a first external pin of the integrated circuit chip, the first external pin to allow an external capacitance to be connected to the output terminal. The reference buffer further includes a variable, settable resistance sub-circuit connected to a second bond pad, the second bond pad also being connected to the first external pin. The resistance sub-circuit is configured to be set to exhibit a resistance value to critically dampen a response of the reference buffer amplifier.
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