发明名称 |
THERMOSETTING RESIN COMPOSITION |
摘要 |
<p>PURPOSE: A thermosetting resin composition is provided to improve the adhesion between a package component and a mounting substrate by using heat generated from a reflow process. CONSTITUTION: A thermosetting resin composition (31) contains an epoxy resin, an organic acid and a thixotropic agent. The epoxy resin contains a dimer acid type epoxy resin. The thermosetting resin composition also contains an epoxy hardener. The thermosetting resin composition also contains a monofunctional glycidyl radical containing compound. The viscosity of the thermosetting resin compositions at the temperature of 40°C is 20 to 3000 Pa·s.</p> |
申请公布号 |
KR20130097099(A) |
申请公布日期 |
2013.09.02 |
申请号 |
KR20130010150 |
申请日期 |
2013.01.30 |
申请人 |
TAMURA CORPORATION |
发明人 |
NAKABAYASHI TAKASHI;KAKITA TOSHIHIKO;AOKI JUN;ISHIGAKI KOUICHI;SUGISAWA YOSHINOBU |
分类号 |
H01L21/60;C08L63/00;H01L23/488 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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