发明名称 CHIP BONDING METHOD AND CHIP BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent an adhesive 11 from entering a sealed space formed as a CCD 6 and a glass chip 9 comes into contact with each other with a spacer 10 interposed.SOLUTION: In an atmospheric pressure controlled chamber in which the atmospheric pressure can be lowered, a glass chip 9 coated with an adhesive 11 is put close to a spacer 10 to bond the glass chip 9 and CCD 6 together. The CCD 6 and glass chip 9 are held one over the other and a sealed space 40 is formed which has its periphery surrounded with the spacer 10 and adhesive 11. The atmospheric pressure is lower outside the sealed space 40 than inside the sealed space 40, so an adhesive 11 having entered the sealed space 40 is pushed out of the sealed space 40.
申请公布号 JP2013168901(A) 申请公布日期 2013.08.29
申请号 JP20120032435 申请日期 2012.02.17
申请人 FUJIFILM CORP 发明人 IWANE HIROYUKI
分类号 H04N5/225;H01L23/02;H01L27/14 主分类号 H04N5/225
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