发明名称 METHODS FOR ETCHING OXIDE LAYERS USING PROCESS GAS PULSING
摘要 Methods for etching an oxide layer disposed on a substrate through a patterned layer defining one or more features to be etched into the oxide layer are provided herein. In some embodiments, a method for etching an oxide layer disposed on a substrate through a patterned layer defining one or more features to be etched into the oxide layer may include: etching the oxide layer through the patterned layer using a process gas comprising a polymer forming gas and an oxygen containing gas to form the one or more features in the oxide layer; and pulsing at least one of the polymer forming gas or the oxygen containing gas for at least a portion of etching the oxide layer to control a dimension of the one or more features.
申请公布号 US2013224960(A1) 申请公布日期 2013.08.29
申请号 US201113882272 申请日期 2011.10.27
申请人 PAYYAPILLY JAIRAJ;KIM JONG MUN;DOAN KENNY;LING LI;APPLIED MATERIALS, INC. 发明人 PAYYAPILLY JAIRAJ;KIM JONG MUN;DOAN KENNY;LING LI
分类号 H01L21/3065 主分类号 H01L21/3065
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