ELECTRONIC COMPONENT MODULE

摘要

An electronic component module includes a rectangular insulating substrate; lands that are arranged on a substrate surface thereof; electronic components that are connected to the lands using solder, and are mounted on the substrate surface; a solder resist protective layer that protects a wiring pattern by covering the substrate surface, and that is raised from the substrate surface toward the electronic components; a non-resist forming region that is not subjected to the solder resist and that exposes the substrate surface; and a sealing resin that seals the electronic components on the substrate surface. The non-resist forming region is formed in such a way as to communicate one side which partitions the substrate surface with another side which is separated from the one side, which partitions the substrate surface, through bottoms of component rear surfaces of the electronic components on the substrate surface.