发明名称 PASSIVATION LAYER FORMED FROM A POLYMER FOR USE WITH A WORKPIECE
摘要 Methods of forming a passivation layer on a workpiece are disclosed. These methods utilize a SiC forming polymer to form the passivation layer. In addition, while the polymer is being heated to form SiC, a second result, such as annealing of the underlying workpiece, or firing of the metal contacts is achieved. For example, the workpiece may be implanted prior to coating it with the polymer. When the workpiece is heated, SiC is formed and the workpiece is annealed. In another embodiment, a workpiece is coating with the SiC forming polymer and metal pattern is applied to the polymer. The firing of workpiece causes the metal contacts to form and also forms SiC on the workpiece.
申请公布号 WO2013126536(A1) 申请公布日期 2013.08.29
申请号 WO2013US27085 申请日期 2013.02.21
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 BATEMAN, NICHOLAS;RAMAPPA, DEEPAK
分类号 H01L31/0216;H01L31/18 主分类号 H01L31/0216
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